Package Portfolio

MTI offers a comprehensive lC packages by lead frame and substrate base under wire bonding or flip chip interconnection. With experienced design team, we can provide the optimal package structure, excellent performance but with cost-effective solutions to help customers to win the market. These package solutions are suitable for the 3C applications in PC, communication, consumer and industry markets…etc ............... more

Turnkey Services

- Wafer Level Packaging
Here is the updated information of our newly developed wafer level packaging technology. To learn more about our new service. ................... more

- Chip Probing
T
o achieve customer success, MTI offers Integration Chip probing services to various customers such as IDM, IC design house…etc. ................... more

- Assembly
A good package design can deliver optimum solution to meet customers’ requirements …etc. ................... more

- Final Test
MTI offers comprehensive final test services for various devices, such as Logic, Analog, Mix-mode, Wire/ Wireless, Radio Frequency (RF), DRAM, NAND/ NOR Flash …etc. ................... more


Press Release

- Dec, 31, 2010
Macrotech Technology Inc. (MTI), today announced the completion of its first shipment of final test for Logic/ Mix-mode devices﹔The major devices MTI tested included Signal processor for digital camera, Mobile TV tuner for mobile phone and Speaker SoC for audio processing by Verigy V93000 and Advantest T2000 platform‧ ..........................more

- June, 15, 2010
Macrotech Technology Inc. (MTI),today announced it did pull ahead the first shipments schedule to customers from originally set plan in Q3, 2010 to Q2 (June, 15, 2010)‧The first shipments were arranged for several customers and products including system in package (SiP),package on package (PoP) and some of memory products which makes use of MTI’s advanced technology‧ ..........................more



Copyright 2010 Macrotech Technology Inc.